校友活动｜2025半导体创新与智能应用峰会（SIIAS）

日期：2025-10-30

🌎 香港首届国际半导体峰会

2025半导体创新与智能应用峰会（SIIAS）

作为本地区的里程碑盛事，SIIAS荣幸呈现香港首届国际半导体峰会。本次峰会由香港科技大学和SEMI联合主办，并获香港特别行政区政府支持，将汇聚全球行业领袖、前沿研究学者与核心政策制定者，共同剖析半导体创新未来，推动产业战略发展。

🗓️ 日期：2025年12月2日（星期二）

⏰ 时间：09:30-17:10

📍 地点：香港科学园12W大展览厅

💬 语言：英语配中文翻译

🌟活动亮点：

- 半导体行业趋势洞察

- 权威专家与国际演讲嘉宾

- 「人工智能」「微机电」与「智能制造」主题体验区

- 针对年轻一代的STEM工作坊

👇🏻立即报名

https://seamless-reg.com/reg/SIIAS/

Meet Our Speakers

Welcome Remarks
	Prof. Tim Cheng Vice-President for Research and Development The Hong Kong University of Science and Technology
	Mr. Lung Chu Corporate Vice President SEMI
Opening Remarks By Guest Of Honour
	Prof. Dong Sun, JP Secretary for Innovation, Technology and Industry The Hong Kong SAR Government
Keynote Speakers
	Mr. Prith Banerjee Senior Vice President Simulation & Analysis Incubation Group, Synopsys
	Mr. Feng Chen Chief Executive Officer Arm Technology (China) Co., Ltd.
	Mr. Steve Chu CEO, Chairman and Founder NPCTEK
	Dr. Teng Gao Chief Executive Officer The Hong Kong Mircoelectronics Research and Development Institute (MRDI)
	Ms. Rosemary Ho Chairman and CEO CIP United Co.
	Dr. Michael Jackson Corporate Vice President and General Manager System Design and Analysis Group, Cadence
	Mr. Choon Khoon Lim Senior Vice President and Chief Counsel Advanced Packaging, Semiconductor Solutions Segment, ASMPT
	Dr. Young Lin Chairman and Chief Executive Officer Fitipower
	Dr. Naveed Sherwani Chairman National Semi-Conductor Hub, Saudi Arabia
	Prof. Hongtao Xu Co-Founder ICLEGEND MICRO